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High density board mounting - メーカー・企業と製品の一覧

High density board mountingの製品一覧

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Shinano Camera Industry Co., Ltd. Business Introduction

Shinano Camera is confident in its adaptability and reliability.

Shinano Camera Industry Co., Ltd. is an EMS manufacturer that can meet all needs from circuit board design and prototyping, assembly manufacturing, procurement of electronic components and various materials, to mass production of finished products. Our company has established an important inspection system that supports high-reliability manufacturing, and we only package products that have cleared various performance tests, confirming each one individually. Additionally, we have achieved speed and labor-saving in prototyping and verification through 3D printing. It also demonstrates its effectiveness in designing prototypes for exterior packaging and checking shapes before molding. 【Business Description】 ■ High-density circuit board assembly and precision equipment assembly *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Other electronic parts

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High-density substrate mounting

Supports mass production of 0603 chips and prototype 0402 chips.

We have a proven track record in mass production of high-density chip mounting, focusing on people's livelihoods, and we possess the know-how to mount 0603 chips with high quality in mass production. At the prototype level, we have experience with 0402 chips. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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[Business Introduction] Scheduled to support 0201! PCB assembly service

Introduction of various inspection devices! Flexibly responding to high precision, high density, and diverse implementation needs.

In our company, to quickly respond to the increasingly compact, lightweight, and high-performance electronic devices, we are further refining the technology cultivated in camera circuit board manufacturing and promoting the introduction of advanced equipment such as chip mounters and inspection devices. We also accommodate fine chip components such as CSP, BGA, QFP, 0402, and 0603. Additionally, we have numerous achievements in FPC board assembly, and with our high technical capabilities and thorough quality control, we provide comprehensive support from board design to assembly to meet a wide range of assembly needs. 【Features】 ■ Flexible response ■ Support for ultra-small chip sizes ■ Quick response ■ Introduction of various inspection devices ■ Compliance with overseas specifications and destinations *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録